Conductive Inks
Showing 13–24 of 24 results
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Deposition: Screen Print Vehicle: Aqueous-based Resistivity: 4.2E-6 to 1.0E-5 ohm cm; 7.0E-6 ohm cm at 140˚C Substrates: Plastics, Paper, Glass, Transparent Conducting Oxides (TCO) Features: Cured films have high electrical conductivity, low surface roughness, good adhesion, and good water and alcohol resistance. On plastics and paper, good flexibility and crease resistance are also observed. Suitable applications include antenna, RFID, sensors, and heaters. -
Deposition: Screen Print Vehicle: Aqueous-based Resistivity: 4.9E-6 to 2.2E-5 ohm cm; 7.4E-6 ohm cm at 140˚C Substrates: Plastics, Paper, Glass, Transparent Conducting Oxides (TCO) Features: Designed to cure at low temperatures (as low as 60˚C). Cured films have high electrical conductivity, low surface roughness, excellent adhesion, and good water and alcohol resistance. On plastics and paper, good flexibility and crease resistance are also observed. Suitable applications include flexible solar cells, antenna, RFID, sensors, and heaters. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 6.4E-6 to 1.1E-5 ohm-cm Substrates: Glass, Transparent Conducting Oxides (TCO), Plastics, Paper Features: Specifically designed for glass and transparent conducting oxide (TCO) surfaces. When cured, exhibits high electrical conductivity, good adhesion, and low surface roughness. May be used as a seed layer for electroplating metals. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 5.7E-6 to 1.7E-5 ohm-cm Substrates: Plastics, Paper Features: Produces cured films with high electrical conductivity, good scratch and abrasion resistance, and good adhesion. May be used in EMI / RF shielding, filter and membrane design for wastewater treatment, and as a seed layer for metal electroplating. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 5.4E-6 to 1.2E-5 ohm-cm Substrates: Plastics Features: Originally designed for liquid crystal polymers (LCPs). Cured films exhibit high electrical conductivity, good scratch and abrasion resistance, and good adhesion. May be used in electronics packaging technology, EMI / RF shielding, and as a seed layer for metal electroplating.