Showing 25–33 of 33 results
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Deposition: |
Aerosol |
Vehicle: |
Aqueous |
Resistivity: |
3.0E-4 to 1.0E-5 ohm-cm |
Substrates: |
Plastics, glass and metal |
Features: |
Contains a polyurethane for excellent adhesion and water resistance |
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Vehicle: |
Dowanol PM |
Resistivity: |
3.8E-5 to 1.0E-5 ohm-cm |
Substrates: |
Paper, plastics, glass, metal |
Features: |
Excellent adhesion and water resistance |
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Deposition: |
Screen Print |
Vehicle: |
Butyl carbitol |
Resistivity: |
1.0E-5 to 2.3E-5 ohm-cm |
Substrates: |
Paper, plastics, glass, metal |
Features: |
Excellent adhesion and water resistance |
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Deposition: |
Screen Print |
Vehicle: |
Butyl carbitol |
Resistivity: |
5.1E-6 to 2.8E-5 ohm-cm |
Substrates: |
Paper, plastics, glass, metal |
Features: |
Low viscosity, high conductivity |
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Deposition: |
Screen Print |
Vehicle: |
Butyl Carbitol |
Resistivity: |
67E-6 – 3.5E-6 ohm-cm |
Substrates: |
Paper, plastics, glass, metal |
Features: |
Good conductivity, fine line printing, excellent adhesion and water resistance |
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Deposition: |
Inkjet |
Vehicle: |
Aqueous-based |
Resistivity: |
0.5 to 0.8 ohm-cm |
Substrates: |
Coated and uncoated plastics and glass |
Features: |
Resistive ink contains fluoropolymer for excellent adhesion |
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Deposition: |
Inkjet |
Vehicle: |
Aqueous |
Resistivity: |
9.9E-6 to 5.3E-4 ohm-cm |
Substrates: |
Plastics, Glass, (Paper with PulseForge processing) |
Features: |
Contains a polyurethane binder for excellent adhesion |
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Deposition: |
Inkjet |
Vehicle: |
Aqueous |
Resistivity: |
7.8E-6 to 3.1E-5 ohm-cm |
Substrates: |
Coated papers, coated or uncoated plastics, and glass |
Features: |
Reflective silver ink for digital optical effects |
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Deposition: |
Spray |
Vehicle: |
Aqueous-based |
Resistivity: |
6.4E-6 to 1.1E-5 ohm-cm |
Substrates: |
Glass, Transparent Conducting Oxides (TCO), Plastics, Paper |
Features: |
Specifically designed for glass and transparent conducting oxide (TCO) surfaces. When cured, exhibits high electrical conductivity, good adhesion, and low surface roughness. May be used as a seed layer for electroplating metals. |