Conductive Inks
Showing 25–33 of 33 results
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Deposition: Inkjet Vehicle: Aqueous-based Resistivity: 0.5 to 0.8 ohm-cm Substrates: Coated and uncoated plastics and glass Features: Resistive ink contains fluoropolymer for excellent adhesion -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.8E-6 to 3.1E-5 ohm-cm Substrates: Plastics, (Paper with PulseForge processing) Features: High conductivity -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.8E-6 to 3.1E-5 ohm-cm Substrates: Plastics, (Paper with PulseForge processing) Features: High conductivity -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 9.9E-6 to 5.3E-4 ohm-cm Substrates: Plastics, Glass, (Paper with PulseForge processing) Features: Contains a polyurethane binder for excellent adhesion -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.8E-6 to 3.1E-5 ohm-cm Substrates: Coated papers, coated or uncoated plastics, and glass Features: Reflective silver ink for digital optical effects -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 9E-6 to 1.1E-5 ohm-cm Substrates: Plastics, Paper Features: Well-suited for applications where a high electrical conductivity is required. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 1.2E-5 to 1.4E-5 ohm-cm Substrates: Plastics, Paper Features: Easily cured at temperatures as low as 70˚C. Cured films exhibit excellent scratch and abrasion resistance, salt spray resistance, and excellent adhesion. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 6.4E-6 to 1.1E-5 ohm-cm Substrates: Glass, Transparent Conducting Oxides (TCO), Plastics, Paper Features: Specifically designed for glass and transparent conducting oxide (TCO) surfaces. When cured, exhibits high electrical conductivity, good adhesion, and low surface roughness. May be used as a seed layer for electroplating metals. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 5.7E-6 to 1.7E-5 ohm-cm Substrates: Plastics, Paper Features: Produces cured films with high electrical conductivity, good scratch and abrasion resistance, and good adhesion. May be used in EMI / RF shielding, filter and membrane design for wastewater treatment, and as a seed layer for metal electroplating.
