PARTICLE Copper nanoparticle
LOADING (WT%) ~ 62
VEHICLE Glycol ether
CURING TEMP (C) 250°C formic acid or PulseForge
RESISTIVITY (OHM-CM) 3.4E-6 to 7.7E-6
SUBSTRATES PET and polyimide
FEATURES process with PulseForge, laser or formic acid vapor
ATOMIZER Pneumatic