PARTICLE	Copper nanoparticle
LOADING (WT%)	~ 62
VEHICLE	Glycol ether
CURING TEMP (C)	250°C formic acid or PulseForge
RESISTIVITY (OHM-CM)	3.4E-6 to 7.7E-6
SUBSTRATES	PET and polyimide
FEATURES	process with PulseForge, laser or formic acid vapor
ATOMIZER	Pneumatic