Conductive Inks
Showing 25–30 of 30 results
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Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.8E-6 to 3.1E-5 ohm-cm Substrates: Plastics, (Paper with PulseForge processing) Features: High conductivity Select options This product has multiple variants. The options may be chosen on the product page Click to Compare -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 9.9E-6 to 5.3E-4 ohm-cm Substrates: Plastics, Glass, (Paper with PulseForge processing) Features: Contains a polyurethane binder for excellent adhesion Select options This product has multiple variants. The options may be chosen on the product page Click to Compare -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 9E-6 to 1.1E-5 ohm-cm Substrates: Plastics, Paper Features: Well-suited for applications where a high electrical conductivity is required. Select options This product has multiple variants. The options may be chosen on the product page Click to Compare -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 1.2E-5 to 1.4E-5 ohm-cm Substrates: Plastics, Paper Features: Easily cured at temperatures as low as 70˚C. Cured films exhibit excellent scratch and abrasion resistance, salt spray resistance, and excellent adhesion. Select options This product has multiple variants. The options may be chosen on the product page Click to Compare -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 6.4E-6 to 1.1E-5 ohm-cm Substrates: Glass, Transparent Conducting Oxides (TCO), Plastics, Paper Features: Specifically designed for glass and transparent conducting oxide (TCO) surfaces. When cured, exhibits high electrical conductivity, good adhesion, and low surface roughness. May be used as a seed layer for electroplating metals. Select options This product has multiple variants. The options may be chosen on the product page Click to Compare -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 5.7E-6 to 1.7E-5 ohm-cm Substrates: Plastics, Paper Features: Produces cured films with high electrical conductivity, good scratch and abrasion resistance, and good adhesion. May be used in EMI / RF shielding, filter and membrane design for wastewater treatment, and as a seed layer for metal electroplating. Select options This product has multiple variants. The options may be chosen on the product page Click to Compare