$200.00
CI-006 Copper Nanoparticle Ink
Conductive InksAerosol Conductive Inks| Deposition: | Aerosol |
| Vehicle: | Glycol ether |
| Resistivity: | 3.4E-6 to 7.7E-6 ohm-cm |
| Substrates: | PET, polyimide |
| Features: | Requires laser curing under reducing atmosphere or formic acid vapor |
Suitable for Polyimide (PI) and PET substrates, CI-006 is a glycol-ether-based copper nanoparticle superior conductive ink with aerosol pneumatic atomization, and is both photonically sinterable and solderable on PI – and on PET with a formic acid atmosphere. CI-006 requires laser curing under reducing atmosphere or formic acid vapor.
| Pigment/Loading: | Copper nanoparticles @ 60wt% |
| Vehicle: | Glycol ether |
| Resistivity: | 3.4E-6 ohm-cm (laser with H2); 7.7E-6 ohm-cm (30min @ 190C formic acid) |
| Substrates: | PET, polyimide |
| Features: | Requires laser curing under reducing atmosphere or formic acid vapor |
| Atomizer: | Pneumatic |
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