$200.00

CI-006 Copper Nanoparticle Ink

Conductive InksAerosol Conductive Inks
Deposition: Aerosol
Vehicle: Glycol ether
Resistivity: 3.4E-6 to 7.7E-6 ohm-cm
Substrates: PET, polyimide
Features: Requires laser curing under reducing atmosphere or formic acid vapor
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Suitable for Polyimide (PI) and PET substrates, CI-006 is a glycol-ether-based copper nanoparticle superior conductive ink with aerosol pneumatic atomization, and is both photonically sinterable and solderable on PI – and on PET with a formic acid atmosphere. CI-006 requires laser curing under reducing atmosphere or formic acid vapor.

 

Due to our mill being under repair, we currently have 100g left of this product. We will not being taking backorder orders at this time after that. We apologize for any inconvenience. 

Pigment/Loading: Copper nanoparticles @ 60wt%
Vehicle: Glycol ether
Resistivity: 3.4E-6 ohm-cm (laser with H2); 7.7E-6 ohm-cm (30min @ 190C formic acid)
Substrates: PET, polyimide
Features: Requires laser curing under reducing atmosphere or formic acid vapor
Atomizer: Pneumatic

 

Technical Data Sheet

Safety Data Sheet