Welcome to the inaugural issue of our quarterly technical newsletter.
This publication is intended to provide customers and partners with a focused view into our work across materials development, process compatibility, and application-driven challenges in printed and flexible electronics. Rather than product announcements alone, this update is designed to share insight into how materials and processes are evolving in response to real-world requirements—from research environments to scalable manufacturing.
Each quarter, we will highlight material platforms, application learnings, and broader technology trends shaped by close collaboration with customers, partners, and the research community. Our aim is to foster a technical dialogue and provide content that is directly relevant to engineers, scientists, and development teams working at the intersection of materials and manufacturing.
Business Overview: Momentum and Global Reach
Over the past year, NovaCentrix continued to build sustained momentum across its materials portfolio, reaching several meaningful milestones that reflect both technical validation and expanding global adoption.
The company achieved its fifth consecutive year of increased revenue, supported by continued demand across research, development, and early production environments. In parallel, NovaCentrix recorded the largest number of total shipments in its history, signaling broader and more consistent use of its materials within customer workflows.
From a geographic perspective, the past year also marked an expansion of global reach. Products were shipped to 37 countries worldwide, supporting customers and partners across diverse innovation ecosystems. We extended our global reach with shipments to two new countries, reflecting growing interest in advanced functional materials across new regions and application spaces.
Collectively, these outcomes point to increasing confidence in material performance, process compatibility, and long-term reliability across a wide range of substrates, printing technologies, and end-use requirements.
New Product Highlights
Driven by application-specific requirements around thermal budgets, fine-feature resolution, conductivity, and cost optimization, NovaCentrix expanded its conductive ink portfolio across multiple material platforms.
The Ultra™ family of conductive inks was introduced to address the need for very high conductivity at low curing temperatures, with processing temperatures below 100 °C. These high-viscosity formulations, optimized for screen printing and precision dispensing, enable very fine printed features (< 25 µm) while achieving conductivities approaching 50% of bulk metal values. This combination supports compact, low-resistance features on temperature-sensitive substrates.
Complementing this platform, the HPSC-Ultra™ family of silver-coated copper inks was introduced as a more economical alternative to pure silver inks. By offering tunable silver-to-copper ratios, these materials allow users to balance cost and electrical performance based on application needs. The HPSC-Ultra™ inks are also solderable, enabling compatibility with conventional electronic assembly processes.
In parallel, NovaCentrix continued to expand its precious metal ink offerings. The company’s jettable gold ink experienced a record increase in sales, driven primarily by strong demand from the biomedical, electronics, and display manufacturing sectors, where chemical stability, reliability, and fine-feature capability are critical. Additionally, experimental platinum (Pt) ink formulations were introduced for aerosol-based printing processes, addressing interest in chemically robust and high-temperature-stable conductors. Both the gold and platinum systems are also available as water-dispersed nanoparticle formulations, expanding processing and integration flexibility.
Looking Ahead
As we move into the coming year, our focus remains firmly on technical partnerships and collaboration. Many of today’s most challenging problems are driven by new market pulls and emerging applications, where materials and processes must evolve together.
Our greatest asset continues to be our technical team, working closely with customers, collaborators, and partners to address complex challenges as they arise. Examples of this work are regularly shared through our Partner Highlight and Research Highlight sections on our blog, and we look forward to continuing to build on these collaborations in the year ahead.
Help Shape the Next Issue
We view this newsletter as a two-way technical conversation. Future issues will be shaped in part by the topics most relevant to you.
We’d welcome your input on areas you’d like us to explore further, including:
- Specific material systems or ink platforms
- Printing, curing, or post-processing considerations
- Reliability, scaling, or integration challenges
- Research-to-manufacturing transitions
If there are topics you’d like to see covered in future issues, please let us know.
Best regards,
Rudy Ghosh, PhD
VP, Business and Applications Development
NovaCentrix
